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Title:
MANUFACTURING METHOD OF CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2009087615
Kind Code:
A
Abstract:

To provide a manufacturing method of a conductive material which is suitable for adhesive performance between an image and a functional layer, and has a metal pattern suitable for adhesive performance between a support and the image.

In the manufacturing method for the conductive material wherein a conductive material precursor having at least a physical developing core layer and a silver halide emulsion layer on the support in this order is exposed in an image shape, and then, metal silver is deposited by developing treatment, the conductive material precursor has an under-coated layer including no protein between the support and the physical developing core layer, and enzyme treatment is applied after the developing treatment.


Inventors:
Shibata, Yoshio
Yoshiki, Takenobu
Application Number:
JP2007000253514
Publication Date:
April 23, 2009
Filing Date:
September 28, 2007
Export Citation:
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Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H01B13/00; G03C1/035; G03C5/26; H05K9/00
Domestic Patent References:
JP2007012404A
JP2006111889A
JP2001022050A
JP2007127946A