To provide a manufacturing method of a conductive material which has a high conductivity and can form a wiring pattern in which a fattening of a wire width of a conductor circuit by an electroless copper plating is limited.

After forming a silver image at least on the one surface of a supporting body, a plating treatment is conducted on the silver image in a first plating bath in which a dissolved oxygen density in the electroless copper plating liquid is 4 ppm or more, and thereafter, a plating treatment is conducted in a second plating bath in which the dissolved oxygen density in the electroless copper plating liquid is less than 4 ppm.