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Patent Searching and Data


Title:
MANUFACTURING METHOD OF CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2009146587
Kind Code:
A
Abstract:

To provide a manufacturing method of a conductive material which has a high conductivity and can form a wiring pattern in which a fattening of a wire width of a conductor circuit by an electroless copper plating is limited.

After forming a silver image at least on the one surface of a supporting body, a plating treatment is conducted on the silver image in a first plating bath in which a dissolved oxygen density in the electroless copper plating liquid is 4 ppm or more, and thereafter, a plating treatment is conducted in a second plating bath in which the dissolved oxygen density in the electroless copper plating liquid is less than 4 ppm.


Inventors:
Gokan, Hirohiko
Ishikura, Hiroyuki
Application Number:
JP2007000319610
Publication Date:
July 02, 2009
Filing Date:
December 11, 2007
Export Citation:
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Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H01B13/00; C23C18/38; G03C5/26