Title:
MANUFACTURING METHOD OF CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2023046305
Kind Code:
A
Abstract:
To connect a fine electronic component and a substrate using a conductive particle containing film.SOLUTION: A manufacturing method of a connection structure 40 in which a fine electronic component 1 having a length of a longest side of 600 μm or less or an area of each electrode of 1000 μm2 or less is electrically connected with a substrate 20 including an electrode 21 corresponding to an electrode 2 of the electronic component 1 includes: an overlapping step of overlapping the electronic component 1 and the substrate 20 via a conductive particle containing film 10 in which conductive particles 11 are held in an insulating resin layer 12; and a pressurizing and curing step of curing the insulating resin layer 12 of the conductive particle containing film while pressurizing the electronic component and the substrate which overlap via the conductive particle containing film. Regarding curing characteristics of the conductive particle containing film 10, in a case where the conductive particle containing film 10 is heated from 40°C to 80°C, a time from heating start to curing start of the insulating resin layer 12 is 10 minutes or more.SELECTED DRAWING: Figure 8
Inventors:
HAYASHI SHINICHI
TSUKAO SATOSHI
SHINOHARA SEIICHIRO
TANAKA YUSUKE
TSUKAO SATOSHI
SHINOHARA SEIICHIRO
TANAKA YUSUKE
Application Number:
JP2022149425A
Publication Date:
April 03, 2023
Filing Date:
September 20, 2022
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
H01L21/60
Attorney, Agent or Firm:
Patent Attorney Corporation Taji International Patent Office