Title:
コネクタ用基板及びコネクタの製造方法
Document Type and Number:
Japanese Patent JP5332288
Kind Code:
B2
Inventors:
Hidehiro Nakamura
Application Number:
JP2008110083A
Publication Date:
November 06, 2013
Filing Date:
April 21, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K1/02; H05K1/11; H05K3/40
Domestic Patent References:
| JP6177497A | ||||
| JP2004335547A | ||||
| JP2007235111A |
Attorney, Agent or Firm:
Hidekazu Miyoshi