To provide a manufacturing method of a connector connecting terminal thinly and uniformly forming the thickness of a solder layer when the solder layer is formed by printing inexpensive solder paste without using lead to the connector connecting terminal.

The connector connecting terminal 20 comprises a plurality of contact pieces 14 mounted on a printed wiring board 10. The termination part of the connector connecting terminal 20 is extended longer than a predetermined length L, and a connection region 22 connecting the extended parts 21 to one another is formed. Solder paste 16 is printed to areas among the contact pieces 14 and all of the extended parts 21 including the connection region 22, and a solder pre-coat layer 17 is formed by fusing the printed solder paste 16. Thereafter, the connector connecting terminal 20 having the predetermined length L is formed by cutting and removing the extended parts 21 including the connection region 22.