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Title:
MANUFACTURING METHOD FOR COPPER-CLAD ALUMINUM WIRE
Document Type and Number:
Japanese Patent JP2007152398
Kind Code:
A
Abstract:

To provide a manufacturing method for a copper-clad aluminum wire having a high adhesiveness between a copper layer and an aluminum wire, in which the peeling of a copper layer and the breakage of a wire in wire drawing occur less frequently, and in which blistering in annealing heat treatment occurs less frequently.

The manufacturing method for a copper-clad aluminum wire is carried out as follows: an aluminum wire is arranged longitudinally along a copper tape; the copper tape is continuously formed into a tubular shape by roll forming so as to cover the aluminum wire; a composite wire is obtained by a tube making method of continuously welding the butted parts of the tubular copper tape; and the composite wire is drawn until the diameter thereof becomes a prescribed one. In this method, the surface roughness (Ra) of the aluminum wire used as a material is 5-50 μm, and the surface roughness (Ra) of the copper tape to be brought into contact with the aluminum wire is ≤10 μm.


Inventors:
OHATA YOSUKE
Application Number:
JP2005351042A
Publication Date:
June 21, 2007
Filing Date:
December 05, 2005
Export Citation:
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Assignee:
VISCAS CORP
FURUKAWA ELECTRIC CO LTD
FUJIKURA LTD
International Classes:
B21C37/06; B21C1/00
Attorney, Agent or Firm:
Takaho Kawawa