Title:
高周波信号伝送に応用される銅箔の製造方法、及び回路基板アセンブリの製造方法
Document Type and Number:
Japanese Patent JP7164366
Kind Code:
B2
Abstract:
A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.
Inventors:
Shiharu Hayashi
chen
chen
Application Number:
JP2018171636A
Publication Date:
November 01, 2022
Filing Date:
September 13, 2018
Export Citation:
Assignee:
NAN YA PLASTICS CORPORATION
International Classes:
C25D7/06; C25D1/00; C25D1/04; C25D3/04; C25D3/38; C25D3/56; C25D5/12; C25D5/14; C25D5/16; H05K1/03; H05K1/09
Domestic Patent References:
| JP2004256910A | ||||
| JP2011168887A | ||||
| JP6058182B1 | ||||
| JP9272994A |
Attorney, Agent or Firm:
Shigeru Kinoshita