Title:
Manufacturing method of copper foil with carrier, laminate, printed wiring board and manufacturing method of electronic equipment
Document Type and Number:
Japanese Patent JP6339636
Kind Code:
B2
Abstract:
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm2 at 220° C. for 2 hours is 0.181 to 2.922 μm.
Inventors:
Nobuaki Miyamoto
Application Number:
JP2016140887A
Publication Date:
June 06, 2018
Filing Date:
July 15, 2016
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
H05K1/03; B32B15/08; C25D1/04; C25D5/10; C25D5/16; C25D7/06; H05K1/09
Foreign References:
| WO2015012327A1 | ||||
| WO2015108191A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation