切断用ブレードの製造方法 - Tokyo Seimitsu Co., Ltd.

Title:

切断用ブレードの製造方法

Document Type and Number:

Japanese Patent JP6641590

Kind Code:

B2

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Inventors:

Masato Nakamura

Application Number:

JP2015248990A

Publication Date:

February 05, 2020

Filing Date:

December 21, 2015

Export Citation:

Assignee:

Tokyo Seimitsu Co., Ltd.

International Classes:

B24D3/00; B24D5/12; H01L21/301

Domestic Patent References:

Attorney, Agent or Firm:

Field Saki Satoshi
Shingo Suzuki
Tetsuo Yamazaki
Fumihiro Hosokawa
Masatake Shiga

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