To provide an electrical contact that enables stable connection with superior conductivity and wear-proof performance.
After a contact point is formed on copper foil 40 that has a shape conforming to a contact partner's shape, a passivation film member 30 is pasted so that at least the point of contact with the contact partner may be exposed, then, a conductive hard thin film 21 is applied to the whole surface. Next, the passivation film 30 is removed, thereby setting the conductive hard thin film 21 to at least the point of contact with the contact partner. By this construction, a contact point of a shape conforming to a contact partner's shape is formed on the copper foil 40, and a slit 22 with an approximate U shape is formed around the contact point. An elastic body is arranged below the copper foil 40, a passivation film member 30 is pasted so that at least the point of contact with the contact partner is exposed, then, the conductive hard thin film 21 is set to the whole surface, and the passivation film member 30 is removed. Accordingly, a conductive hard thin film 21 is set to at least that part of contact with the contact partner, and the partner moves slidingly on the contact point when engaged with the contact partner.
| WO/1999/051071 | SMD-CAPABLE HYBRID CIRCUIT |
| JP2010114193 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD |
YAMAZAKI YASUE
DAIMON HIROBUMI
