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Patent Searching and Data


Title:
MANUFACTURING METHOD OF ELECTRODEPOSITION GRINDSTONE FOR CUTTING
Document Type and Number:
Japanese Patent JPS59110560
Kind Code:
A
Abstract:

PURPOSE: To make the service life of a grindstone long by subjecting the grindstone to non-electrolytic metal plating after subjecting the surface and the edge face of a rigid thin base material to non-electrolytic eutectoid plating with the abrasive grains of diamond, etc., and nickel, etc., in a hard brittle material cutting grindstone.

CONSTITUTION: The first eutectoid plated layer 6 is formed by machining thin carbon tool steel 4 so as not to produce any disk-shaped warpage and burrs and subjecting the surface and edge face of said steel to non-electrolytic eutectoid plating with abrasive grains such as diamond and metal such as nickel. Subsequently, after washing it with water and acid, the secondary eutectoid plated layer 7 is formed to the extent where the abrasive grains 5 are not burried in said plated layer by performing non-electrolytic metal plating of nickel, etc., not containing diamond. In this way, the diamond abrasive grains 5 are coupled to the base material 4 by both plated layers 6, 7. Accordingly, a thin and rigid grindstone is yielded with the good thickness accuracy of the grindstone and with the increased abrasive grain holding force, allowing the grindstone to enjoy its long service life.


Inventors:
ITOU MITSURU
SUZUKI TAKASHI
Application Number:
JP22143582A
Publication Date:
June 26, 1984
Filing Date:
December 16, 1982
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B24D3/06; B24D18/00; (IPC1-7): B24D3/06
Attorney, Agent or Firm:
Toshio Nakao