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Title:
MANUFACTURING METHOD FOR ELECTRON EMISSION DEVICE HAVING HIGH PACKING DENSITY
Document Type and Number:
Japanese Patent JP2005285778
Kind Code:
A
Abstract:

To provide a structure of an electron emission device having high packing density of an emitter and to provide its manufacturing process.

An electron emission property element suitable for a flat panel type display is manufactured by high packing density. An electronic emitter has a base supporting the structure. A lower side non-insulation region patterned into a shape forming a plurality of parallel lines is formed on an insulation material which is the base. An electron emission property filament is formed in a hole extending in an insulation layer provided on the lower side non-insulation region. Typically, a patterned non-insulation gate layer is provided on the insulation layer to form a gate control type device. Preferably, a position of an electron emission mechanism is delimited using a charged particle track. By using the charged particle track, the electron emission mechanism is greatly miniaturized and is arranged by bringing mutual interval close.


Inventors:
MACAULAY JOHN M
SPINDT CHRISTOPHER J
SEARSON PETER C
DUBOC JR ROBERT M
Application Number:
JP2005135104A
Publication Date:
October 13, 2005
Filing Date:
May 06, 2005
Export Citation:
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Assignee:
CANDESCENT INTELLECTUAL PROP
International Classes:
H01J1/30; H01J1/304; H01J3/02; H01J9/02; H01J29/04; H01J31/12; (IPC1-7): H01J9/02
Attorney, Agent or Firm:
Yoichi Oshima



 
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