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Title:
MANUFACTURING METHOD FOR ELECTRON EMISSION DEVICE HAVING HIGH PACKING DENSITY
Document Type and Number:
Japanese Patent JP3793219
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a structure of an electron emission device having high packing density of an emitter and to provide its manufacturing process.
SOLUTION: An electron emission property element suitable for a flat panel type display is manufactured by high packing density. An electronic emitter has a base supporting the structure. A lower side non-insulation region patterned into a shape forming a plurality of parallel lines is formed on an insulation material which is the base. An electron emission property filament is formed in a hole extending in an insulation layer provided on the lower side non-insulation region. Typically, a patterned non-insulation gate layer is provided on the insulation layer to form a gate control type device. Preferably, a position of an electron emission mechanism is delimited using a charged particle track. By using the charged particle track, the electron emission mechanism is greatly miniaturized and is arranged by bringing mutual interval close.


Inventors:
Macauray, John M
Spinto, Christopher Jay
Searson, Peter Sea
Dubock, Robert M. Jr.
Application Number:
JP2005135104A
Publication Date:
July 05, 2006
Filing Date:
May 06, 2005
Export Citation:
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Assignee:
Canon Inc
International Classes:
H01J9/02; H01J1/30; H01J1/304; H01J3/02; H01J29/04; H01J31/12; (IPC1-7): H01J9/02
Domestic Patent References:
JP1149351A
JP5094760A
JP1300558A
JP4359831A
JP51097971A
JP5097598A
JP3182029A
JP5211030A
JP5205615A
JP7029484A
JP4036922A
JP7014500A
Attorney, Agent or Firm:
Yoichi Oshima
Keizo Nishiyama