To provide a manufacturing method for an electronic component, capable of reducing the area covered by a probe, capable of facilitating regulation work, and capable of enhancing the flexibility of layout of a regulating electrode.

In this method for regulating a characteristic of each sub-substrate A by trimming under a new substrate condition connected with the plurality of sub-substrates, one of the measurement probes 11 is brought into contact with a terminal electrode 21 of the adjacent sub-substrate A1 connected to a terminal electrode 2 of the sub-substrate A to be trimmed, via an inner layer electrode 8, and the other is brought into contact with the terminal electrode 21 of the adjacent sub-substrate A1 connected to the terminal electrode 2 of the sub-substrate A via an inner layer electrode 8. The regulation electrode 4 for the sub-substrate A is laser-trimmed while made to contact the probe 11. The laser is thereby precluded from interfering with the probes 11 to facilitate the trimming.