MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Title:

MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP2005286253

Kind Code:

A

Abstract:

To eliminate appearance failure caused by a hanging down of a coating formation liquid, when pulling up and hardening by immersing an electronic component element in a thermosetting coating formation liquid.

The electronic component element such as a varistor or the like which has lead lines is pulled up, after being immersed in the coating formation liquid containing thermosetting resin, and the coating formation liquid adhered to the electronic component element is hardened in semi-cured by being heated. In this case, the coating formation liquid is stated in semi-cured, in such a states that it keeps hanging down by own weight. Thus, coating is shaped by cutting a hanging down portion of the coating formation which is stated in the semi-cured. After that, the coating consisting of the thermosetting resin is hardened into full-cured state by being heated again.

Inventors:

MATSUDA KIYOSHI
KONDO AKIHITO
WATABE OSAMU

Application Number:

JP2004101559A

Publication Date:

October 13, 2005

Filing Date:

March 30, 2004

Export Citation:

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Assignee:

NIPPON CHEMICON

International Classes:

H01G4/12; H01C17/02; H01G2/10; H01G4/18; H01G4/224; H01G9/00; H01G9/08; H01G13/00; (IPC1-7): H01C17/02; H01G4/12; H01G4/224; H01G9/00; H01G9/08; H01G13/00

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