Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP7417844
Kind Code:
B2
Abstract:
The present invention provides a method for manufacturing an electronic component, the method making it possible to effectively separate a rectangular green sheet from a carrier film. The present invention comprises: a preparation step for preparing an elongated carrier film 5, on one main surface of which is formed an elongated green sheet 6; a cutting step for cutting the elongated green sheet 6 to form rectangular green sheets 7 on the carrier film 5; and a separation step for separating the rectangular green sheets 7 from the carrier film 5 using a separation roller 4.
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Inventors:
Tsunemasa Irie
Kazuya Yamamura
Kengo Shimizu
Kuki Hiroshi
Kazuya Yamamura
Kengo Shimizu
Kuki Hiroshi
Application Number:
JP2020571279A
Publication Date:
January 19, 2024
Filing Date:
February 07, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00; H01G4/30
Domestic Patent References:
| JP2011258930A | ||||
| JP9129483A | ||||
| JP2015037127A | ||||
| JP52153747A |
Attorney, Agent or Firm:
Takashi Kawamoto
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