Title:
MANUFACTURING METHOD FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS AND MOBILE BODY
Document Type and Number:
Japanese Patent JP2014150165
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic device, capable of preventing a connection failure caused by plastic deformation of low-melting-point glass due to excessive heat, and an electronic device manufactured using the manufacturing method.SOLUTION: The electronic device is manufactured by a manufacturing method that includes a process for controlling the temperature of a base substrate on which electronic components are arranged, in joining a lid body and the base substrate using a joining material such as low-melting-point glass, the process including: a first step of rising the temperature at a first gradient; a second step of controlling the temperature to be constant at a second gradient smaller than the first gradient; and a third step of rising the temperature at a third gradient larger than the second gradient.
Inventors:
KOBAYASHI TAKAHIRO
Application Number:
JP2013018180A
Publication Date:
August 21, 2014
Filing Date:
February 01, 2013
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L23/02; H01L23/08; H03H3/02; H03H9/10
Attorney, Agent or Firm:
Masaaki Kamiyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe
Kazuhiko Miyasaka
Kazuaki Watanabe
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