Title:
MANUFACTURING METHOD OF ELECTRONIC DEVICE OR ELECTRONIC CIRCUIT, MANUFACTURING APPARATUS OF ELECTRONIC DEVICE OR ELECTRONIC CIRCUIT, ELECTRONIC DEVICE SUBSTRATE AND ELECTRONIC CIRCUIT SUBSTRATE
Document Type and Number:
Japanese Patent JP2009112965
Kind Code:
A
Abstract:
To provide a new manufacturing method of an electronic device or an electronic circuit by a simple principle and simple structure.
Jetting is performed such that a jetting amount of liquid from a jetting head for jetting the liquid used for forming a later pattern is larger than that for forming a former pattern when the later pattern formed on the former pattern is larger than the former pattern on account of constitution of the electronic device or the electronic circuit.
Inventors:
Sekiya, Takuro
Application Number:
JP2007000290113
Publication Date:
May 28, 2009
Filing Date:
November 07, 2007
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
B05D7/00; B05C5/00; B05D1/26; H01J1/316; H01J9/02; H05K3/10; B05D7/00; B05C5/00; B05D1/26; H01J1/30; H01J9/02; H05K3/10