To reduce the cost of a high-frequency power amplifier by mounting an air-core coil on a wiring board without using a bulk feeder after forming the air-core coil.
A manufacturing method is provided for an electronic device having a power amplifier. The method includes a process (a) of winding a wire rod around a winding jig to form a helical portion, a process (b) of cutting a part of the wiring rod to separate the helical portion away from the wiring rod, a process (c) of pulling the winding jig out of the helical portion to form the air-core coil, and a process (d) of mounting the air-core coil on the wiring board after the process (c). Consequently, the manufacturing method prevents a plurality of air-core coils from being entangled in an entangled state during the processes (c) and (d).
KOBAYASHI YOSHIHIKO
SATO SUSUMU
TSUKADA KATSUHIKO
ISHIZU AKIO
| JP2002141707A | 2002-05-17 | |||
| JPH10321441A | 1998-12-04 | |||
| JP2002353058A | 2002-12-06 |
| WO2002052589A1 | 2002-07-04 |
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