Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP4293500
Kind Code:
B2
Abstract:
In an electronic component provided with an electric contact(s) producing an electric conduction by contacting with a contact(s) of a second electronic component, the electric contact comprises a lead-free alloy layer containing tin and silver, and a surface layer portion of the alloy layer at least contacting with the contact of the second electronic component is a tin-rich layer having a tin content higher than that of the other portion of the alloy layer.
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Inventors:
Tomoya Otsuki
Yamazaki Yasue
Yamazaki Yasue
Application Number:
JP2001135839A
Publication Date:
July 08, 2009
Filing Date:
May 07, 2001
Export Citation:
Assignee:
DDK Ltd.
International Classes:
H01L21/60; H01L23/498; H01L23/12; H05K3/34; H05K3/32
Domestic Patent References:
| JP200115539A | ||||
| JP200194004A | ||||
| JP2000150034A | ||||
| JP788680A | ||||
| JP2000235062A | ||||
| JP10275811A |
Attorney, Agent or Firm:
Kenji Sugimura
Kosaku Sugimura
Shiro Fujitani
Kiyoshi Kuruma
Kosaku Sugimura
Shiro Fujitani
Kiyoshi Kuruma
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