To provide a method of manufacturing an electronic component such as a laminate ceramic piezoelectric element with an internal electrode layer suppressive in occurrence of cracks during binder-removal processing.

In the method of manufacturing the electronic component, non-conductor paste 30 containing a powder component which does not contain powder to be baked to become an electric conductor, a volatile organic component such as a solvent, and nonvolatile organic components such as a binder and a plasticizer is printed on a green sheet, which becomes a dielectric layer 10, after being compounded for satisfying 0.33<[gap filling factor of non-conductor film before baking]<0.83, defining a gap filling factor of non-conductor film before baking=[(volume of nonvolatile organic component)/ä(volume of nonvolatile organic component)+(volume of powder component)}]/[(1-tap density of powder component/true density of powder component)], in the same layer with the internal electrode paste at a periphery of a printing part for the internal electrode paste. Further, the volatile solvent is volatilized, and baking is carried out to form the internal electrode layer 20.

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