To provide a manufacturing method of an embossed sheet capable of increasing an aspect ratio of the unevenness and pitch of a fine embossed pattern and suitable for manufacturing the embossed sheet free from a flaw and having antireflection effect or the like.

In the manufacturing method of the embossed sheet for forming the regular embosses of an embossing mold to the almost whole surface of a sheetlike material by transfer, a resin layer comprising a photopolymerizable resin is formed on the surface of the sheetlike material to be closely brought into contact with the embossing mold so as to be allowed to follow the embossed shape of the embossing mold and this resin layer is subsequently irradiated with light to produce the adhesive force between the resin layer and the embossing mold. In a state that the resin layer and the embossing mold are partially bonded, the sheetlike material and the embossing mold are allowed to be spaced apart from each other by a predetermined distance and the height of the embossed shape formed to the resin layer is made larger than that of the embossed shape of the embossing mold. Thereafter, the resin layer is irradiated with light and polymerized.