Title:
フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
Document Type and Number:
Japanese Patent JP4994743
Kind Code:
B2
Inventors:
Minoru Morita
Tetsuya Matsuo
Switching Tokuyuki
Hiroki Takahashi
Kazunori Hayata
Tetsuya Matsuo
Switching Tokuyuki
Hiroki Takahashi
Kazunori Hayata
Application Number:
JP2006218241A
Publication Date:
August 08, 2012
Filing Date:
August 10, 2006
Export Citation:
Assignee:
Nippon Steel Chemical Co., Ltd.
International Classes:
C09J7/00; C09J11/00; C09J163/00; C09J171/10; H01L21/301; H01L21/52
Domestic Patent References:
JP2005191069A | ||||
JP2002093825A | ||||
JP9298220A | ||||
JP2003055632A | ||||
JP10120873A | ||||
JP2000204324A | ||||
JP2003268337A |
Foreign References:
WO2005004216A1 |
Attorney, Agent or Firm:
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano
Tomohiro Nakamura
Eiichi Sano