Title:
MANUFACTURING METHOD FOR FLEXIBLE WIRING BOARD
Document Type and Number:
Japanese Patent JP3500339
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a flexible wiring board with optimum impedance.
SOLUTION: Each impedance of separated wiring films 13A and 13B of a first flexible substrate member 10 is measured for each flexible substrate member 10. By using an impedance adjusting conductive film 40 with impedance according to the measured result, the wiring films 13A and 13B are connected to form a flexible wiring board 50. Even when there is a variation in impedance of the wiring films 13A and 13B, the whole impedance of the wiring films 13A and 13B connected with the impedance adjusting conductive film 40 of the flexible wiring board 50 is kept optimum, regardless of the variation in process.
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Inventors:
Hideyuki Kurita
Hiroyuki Hishinuma
Yukio Anzai
Soichiro Kishimoto
Yoshio Arimitsu
Hiroyuki Hishinuma
Yukio Anzai
Soichiro Kishimoto
Yoshio Arimitsu
Application Number:
JP34270399A
Publication Date:
February 23, 2004
Filing Date:
December 02, 1999
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
H05K1/02; H05K3/00; H05K3/36; (IPC1-7): H05K3/00; H05K1/02; H05K3/36
Domestic Patent References:
| JP7106759A | ||||
| JP7202519A | ||||
| JP9199863A | ||||
| JP11317572A |
Attorney, Agent or Firm:
Shigeo Ishijima (1 outside)