Title:
MANUFACTURING METHOD OF FPC AND DISPLAY
Document Type and Number:
Japanese Patent JP2001267376
Kind Code:
A
Abstract:
To achieve an inexpensive FPC and a display that prevent lead burnout caused through tin plating, and the occurrence of resist peel-off in a soldering process.
First tin plating is formed on a copper pattern is subjected to patterning. After that, resist is formed, and second tin plating is made on the copper pattern of a part where the resist is not formed, thus achieving an inexpensive flexible substrate having a fine pattern.
Inventors:
MATSUDAIRA TSUTOMU
KOIZUMI NOBUKAZU
KOIZUMI NOBUKAZU
Application Number:
JP2000070654A
Publication Date:
September 28, 2001
Filing Date:
March 14, 2000
Export Citation:
Assignee:
SEIKO INSTR INC
MARUWA SEISAKUSHO KK
MARUWA SEISAKUSHO KK
International Classes:
G02F1/1345; C23C18/52; C23C28/00; C25D5/10; C25D5/16; C25D5/50; C25D5/56; C25D7/00; H01L21/60; H01R4/02; H05K3/18; H05K3/24; (IPC1-7): H01L21/60; C23C18/52; C23C28/00; C25D5/10; C25D5/16; C25D5/50; C25D5/56; C25D7/00; G02F1/1345; H01R4/02; H05K3/18; H05K3/24
Attorney, Agent or Firm:
Keinosuke Hayashi