Title:
ガラスセラミック多層配線基板の製造方法
Document Type and Number:
Japanese Patent JP4217094
Kind Code:
B2
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Inventors:
Maeda Toshihiko
Application Number:
JP2003089270A
Publication Date:
January 28, 2009
Filing Date:
March 27, 2003
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B28B11/00; H05K3/46; H01L23/12
Domestic Patent References:
| JP5174649A | ||||
| JP5315183A | ||||
| JP1095591A | ||||
| JP2002353625A | ||||
| JP4100295A | ||||
| JP2000327371A | ||||
| JP7221452A | ||||
| JP2000323845A |