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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR GLASS SUBSTRATE WITH THROUGH ELECTRODE AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2012019107
Kind Code:
A
Abstract:

To improve a flatness of a glass substrate 3 provided with a plurality of through electrodes 7.

The manufacturing method comprises: a through-hole formation process S1 in which a minimum area separated from a plate glass 1 by cutting is defined as a unit cell, an effective unit cell EU is formed by drilling a plurality of through-holes 4 in the unit cell, a dummy unit cell DU, where the through-hole is not formed, is dispersed in a region where the effective unit cell EU is formed; an electrode inserting process S2 of inserting an electrode member 6 into the through-hole 4; a welding process S3 of welding the plate glass 1 to the electrode member 6 by heating the plate glass 1 up to a temperature exceeding a softening point thereof; and a grinding process S4 of grinding both sides of the plate glass 1 together with the electrode member 6 and exposing a plurality of the electrode members 6 on the both sides of the plate glass 1 in order to make a plurality of through electrodes 7 that are electrically separated from each other.


Inventors:
Kawai, Noboru
Application Number:
JP2010000156171
Publication Date:
January 26, 2012
Filing Date:
July 08, 2010
Export Citation:
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Assignee:
SEIKO INSTRUMENTS INC
International Classes:
H01L23/15; H01L23/08; H03H3/02; H03H9/02