Title:
ハーフカット済両面テープの製造方法およびハーフカット済両面テープ貼付装置
Document Type and Number:
Japanese Patent JP7064672
Kind Code:
B2
Abstract:
To provide a half-cut double-sided tape from a double-sided tape with a release-liner commercially available in the market by means of a simple process without contacting a cutter blade directly to an adhesive layer when making the half cuts in the half-cut process. The invention includes: a processing protection layer formation step of feeding a protect release paper tape having the release surface to the double-sided tape to form a processing protection layer on the double-sided tape with the release liner; a half-cut step of continuously performing half-cut together with the processing protection layer and the double-sided tape on the release liner while leaving only the release liner, and making a number of the double-sided tape pieces of proper length are held on the release liner; a half-cut double-sided tape winding step of winding the half-cut double-sided tape with the release liner while peeling off the processing protection layer. A cut trace has a fully cut region in the width direction of the double-sided tape on the release liner and a non-cut region in the width direction of the protect release paper tape, so that the peeling is facilitated.
Inventors:
Yoshikawa Nishikawa
Application Number:
JP2021537135A
Publication Date:
May 11, 2022
Filing Date:
August 18, 2020
Export Citation:
Assignee:
Yoshikawa Nishikawa
International Classes:
C09J7/00; B65H35/07
Domestic Patent References:
JP2016008262A | ||||
JP2014094995A | ||||
JP201682166A | ||||
JP201023131A | ||||
JP200652256A | ||||
JP200313013A | ||||
JP5991176A | ||||
JP2018111574A |
Foreign References:
WO2014007116A1 |
Attorney, Agent or Firm:
Michiaki Nagai
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