Title:
中空構造体の製造方法、めっき複合体及び中空構造体
Document Type and Number:
Japanese Patent JP6545389
Kind Code:
B2
Abstract:
The present invention provides a method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core 1 made of aluminum to form a copper plating layer 3; cutting off part of the plated composite to expose cut surfaces of the core 1; and turning a part corresponding to the core 1 into a hollow part 5 by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum 1, thereby producing a hollow structure 5 whose skeletal part 5B is composed of all copper plating layers 3a, 3b, 3c.
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Inventors:
Mizoguchi Masanori
Application Number:
JP2018532179A
Publication Date:
July 17, 2019
Filing Date:
February 22, 2018
Export Citation:
Assignee:
Asahi Denka Laboratory Co., Ltd.
International Classes:
C25D1/02; C23C18/38; C25D1/22; H05K7/20
Domestic Patent References:
| JP9505388A | ||||
| JP6179983A | ||||
| JP49053540A |
Attorney, Agent or Firm:
Takashi Mugishima