Title:
MANUFACTURING METHOD OF INKJET RECORDING HEAD
Document Type and Number:
Japanese Patent JP2008302552
Kind Code:
A
Abstract:
To manufacture an inkjet recording head in a high yield by reducing materials to be required.
Prior to the cutting of a wafer 4, a dicing tape 20 with a hot melt adhesive layer 22 formed on a base film 21 is joined to the rear surface of the wafer 4. Thereafter, the wafer 4 and the adhesive layer 22 are cut at each opening 2, thereby dividing the wafer 4 to a plurality of element substrates 3. Then, the dicing tape 20 is released leaving the adhesive layer 22 only in regions except a formation region of the opening 2 of each separated element substrate 3. After that, each element substrate is joined to a mount substrate 9 using the adhesive layer 22 left in the element substrate 3 as an adhesive.
Inventors:
INAMOTO TADAKI
Application Number:
JP2007150430A
Publication Date:
December 18, 2008
Filing Date:
June 06, 2007
Export Citation:
Assignee:
CANON KK
International Classes:
B41J2/16
Attorney, Agent or Firm:
Akio Miyazaki
Ishibashi Masayuki
Masaaki Ogata
Ishibashi Masayuki
Masaaki Ogata