Title:
絶縁回路基板の製造方法
Document Type and Number:
Japanese Patent JP7272018
Kind Code:
B2
Abstract:
To provide an insulation circuit board and a manufacturing method thereof that can suppress the occurrence of wax stains on the surface of a circuit layer and improve the solder wettability of the circuit layer.SOLUTION: A manufacturing method for an insulation circuit board which manufactures an insulation circuit board by joining a metal plate punched from a metal material by press processing to one surface of a ceramic substrate via a brazing material includes: a press step of forming a part of the metal plate in the thickness direction into a state of protruding from the metal material during the press processing; a laminate forming step of laminating the protruding metal plate on the one surface of the ceramic substrate via the brazing material having an area equal to or larger than the area of the metal plate to form a laminate; a joining step of pressurizing and heating the laminate in the laminating direction to join the metal plate to the ceramic substrate; and a separation step of pressing the metal plate to separate the metal plate from the metal material after the joining step.SELECTED DRAWING: Figure 2
Inventors:
Takuya Matsuo
Shinsuke Aoki
Keiichi Suenaga
Shinsuke Aoki
Keiichi Suenaga
Application Number:
JP2019042595A
Publication Date:
May 12, 2023
Filing Date:
March 08, 2019
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L23/12; H01L23/36
Domestic Patent References:
| JP2007043002A | ||||
| JP2010097963A | ||||
| JP2016039163A | ||||
| JP2007066995A | ||||
| JP2007180306A | ||||
| JP2010016349A |
Foreign References:
| WO2006019099A1 |
Attorney, Agent or Firm:
Masakazu Aoyama
Previous Patent: AIR CURTAIN DEVICE AND AIR CURTAIN FORMING METHOD
Next Patent: INFORMATION PROCESSOR AND AUTOMATIC TICKET EXAMINING MACHINE
Next Patent: INFORMATION PROCESSOR AND AUTOMATIC TICKET EXAMINING MACHINE