To provide a resin composition for an insulation material suitable for not only application for electronic/electric components but also an insulation material for an all-solid state transformer by balancing high dielectric breakdown strength with high thermal conductivity.
This resin composition for an insulation material is prepared by dispersing an inorganic filler in a thermosetting resin composition, and characterized in that the inorganic filler comprises spherical particles each having a particle diameter of 1-100 μm and small particles each having a particle diameter not greater than 100 nm. It is preferable that the added inorganic filler comprises spherical composite particles formed by using the spherical particles each having a particle diameter of 1-100 μm as cores and by attaching the small particles each having a particle diameter not greater than 100 nm to the surfaces of the spherical particles; and the resin composition for an insulation material is prepared by dispersing the spherical particles derived from the spherical composite particles and the small particles in the thermosetting resin composition.
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古川 静枝
水谷 嘉伸
足立 和郎
天川 正士
