Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
絶縁シート、回路基板及び絶縁シートの製造方法
Document Type and Number:
Japanese Patent JP5513840
Kind Code:
B2
More Like This:
JPH10218972THERMOSETTING RESIN COMPOSITION AND COPPER-CLAD LAMINATE
JPH1135805CASTING RESIN COMPOSITION FOR INSULATION FOR ELECTRICAL EQUIPMENT
Inventors:
Kenji Miyata
Toshiki Yamagata
Application Number:
JP2009243151A
Publication Date:
June 04, 2014
Filing Date:
October 22, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
H01B3/40; B32B15/092; B32B27/38; C08J5/18; C08L63/00; H01B3/00; H01B19/00; H05K1/03
Domestic Patent References:
JP2009231250A
JP6091812A
JP4137316A
Foreign References:
WO2008091489A1
Attorney, Agent or Firm:
Kaoru Watanabe



 
Previous Patent: JPS5513839

Next Patent: DETECTING ELEMENT FOR LEAKING OIL