Title:
接合体の製造方法、絶縁回路基板の製造方法、及び、ヒートシンク付き絶縁回路基板の製造方法
Document Type and Number:
Japanese Patent JP6717245
Kind Code:
B2
Abstract:
A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TDof the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.
Inventors:
Yumoto Ryohei
Nagatomo Yoshiyuki
Sotaro Oi
Nagatomo Yoshiyuki
Sotaro Oi
Application Number:
JP2017053689A
Publication Date:
July 01, 2020
Filing Date:
March 17, 2017
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L23/36; B23K1/00; B23K20/00; H01L23/12; H01L25/07; H01L25/18; H01L33/48; H05K1/02; H05K3/38
Domestic Patent References:
| JP2016105452A | ||||
| JP2007237239A | ||||
| JP2004186264A | ||||
| JP6134570A |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga