Title:
積層セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP7432335
Kind Code:
B2
Abstract:
To provide a technique which can form a side margin part on the side face of a laminate by a punching method.SOLUTION: In the manufacturing method of a laminated ceramic electronic component, a series of first side margin sheets are thermocompression-bonded to the first side faces of a plurality of laminates, which are held on a first elastic surface through a first adhesive sheet, in a first condition which includes pressing force by a highly rigid surface. A first side margin part is formed by punching the thermocompression-bonded first side margin sheet with the first side faces of the plurality of laminates. The plurality of laminates are transferred from the first adhesive sheet to the second adhesive sheet. A series of second side margin sheets are thermocompression bonded to the second side faces of the plurality of laminates, which are held on a second elastic surface through the second adhesive sheet and the first side margin part, in a second condition which includes pressing force by a highly rigid surface and is different from the first condition. A second side margin part is formed by punching the thermocompression-bonded second side margin sheet with the second side faces of the plurality of laminates.SELECTED DRAWING: Figure 13
Inventors:
Shota Tanaka
Youichi Kato
Youichi Kato
Application Number:
JP2019185640A
Publication Date:
February 16, 2024
Filing Date:
October 09, 2019
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/30
Domestic Patent References:
| JP2018056464A | ||||
| JP2019160834A | ||||
| JP2019125705A | ||||
| JP2018073909A |
Attorney, Agent or Firm:
Shuhei Katayama