Title:
積層デバイスの製造方法
Document Type and Number:
Japanese Patent JP5296386
Kind Code:
B2
Abstract:
A lamination device manufacturing method for manufacturing a lamination device using a reinforced wafer formed with an annular reinforced portion, includes a wafer lamination step in which a rear surface of the reinforced wafer corresponding to the device area is faced to and joined to the front surface of an underlying wafer with corresponding streets aligned with each other, thus forming a lamination wafer; an electrode connection step in which a via-hole is formed at a position where an electrode is formed in each of the devices of the reinforced wafer constituting part of the lamination wafer, so as to reach a corresponding electrode formed in each of the devices of the underlying wafer, and the via-hole is filled with a conductive material to connect the electrodes; and a division step in which after the electrode connection step is executed, the lamination wafer is cut along the streets and divided into individual lamination devices.
Inventors:
Kazuhisa Arai
Akihito Kawai
Akihito Kawai
Application Number:
JP2008004444A
Publication Date:
September 25, 2013
Filing Date:
January 11, 2008
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/02; H01L21/304
Domestic Patent References:
| JP2008004845A | ||||
| JP2007005666A |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sachiko Okunuki