Title:
積層型電子部品の製造方法
Document Type and Number:
Japanese Patent JP5305042
Kind Code:
B2
Abstract:
A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
Inventors:
Kazushige Kimura
Tabata Misaki
Tomaki Tomaki
Akira Nakamura
Yuuo Abe
Noriyuki Saito
Tabata Misaki
Tomaki Tomaki
Akira Nakamura
Yuuo Abe
Noriyuki Saito
Application Number:
JP2010165398A
Publication Date:
October 02, 2013
Filing Date:
July 22, 2010
Export Citation:
Assignee:
tdk Corporation
International Classes:
H03H7/01; H01F17/00; H01F27/00; H01F41/04; H01G4/40
Domestic Patent References:
| JP2009059888A | ||||
| JP2004363291A | ||||
| JP2009170737A | ||||
| JP2005203629A |
Attorney, Agent or Firm:
Naomichi Masuko