Title:
積層型共振回路部品の製造方法
Document Type and Number:
Japanese Patent JP6968635
Kind Code:
B2
Abstract:
A multilayer resonant circuit component includes a multilayer body in which first electrode layers, which are provided with both coil patterns and capacitor patterns that constitute an LC circuit, are stacked with first insulator layers interposed therebetween. The multilayer body further includes, stacked together with a second insulator layer, at least one of the following: one or more second electrode layers that each include only a capacitor pattern; and a third electrode layer that includes only a coil pattern.
Inventors:
Rikiya Sano
Shinpei Tanabe
Shinpei Tanabe
Application Number:
JP2017172852A
Publication Date:
November 17, 2021
Filing Date:
September 08, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H03H5/02; H01F17/00; H01F27/00; H01G4/40
Domestic Patent References:
| JP2017143116A | ||||
| JP2016201517A | ||||
| JP2006211273A | ||||
| JP5190379A | ||||
| JP10270249A | ||||
| JP2002111422A |
Foreign References:
| WO2016006542A1 |
Attorney, Agent or Firm:
Koji Fukui