Title:
無鉛はんだ組成物の製造方法
Document Type and Number:
Japanese Patent JP6928062
Kind Code:
B2
Abstract:
A solder composition includes about about 11 % to about 17% by weight tin; about 0.5% to about 3% by weight antimony; about 0.5% to about 1.5% by weight copper; about 0.5% to about 5% by weight nickel; about 72% to about 77% by weight indium; about 4% to about 8.5% by weight silver; and about 0.3% to about 1.5% by weight zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.
Inventors:
Fan jenny es
Pereira John
McKin Alexandra M
Gonzalves Joseph Sea
Pereira John
McKin Alexandra M
Gonzalves Joseph Sea
Application Number:
JP2019207393A
Publication Date:
September 01, 2021
Filing Date:
November 15, 2019
Export Citation:
Assignee:
Adaptive Technologies Limited
International Classes:
B23K35/40; B23K35/26; C22C28/00
Domestic Patent References:
| JP6243893B2 | ||||
| JP6846328B2 | ||||
| JP2009504411A |
Foreign References:
| US6253988 |
Attorney, Agent or Firm:
Shuji Sugimoto
Kenro Tsutsumi
Yuka Kobayashi
Kenro Tsutsumi
Yuka Kobayashi