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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2011138831
Kind Code:
A
Abstract:

To provide a manufacturing method for a light-emitting device which easily controls and stabilizes the dispersion of a fluorescent material, improves a light extraction efficiency, and carries out two-stage sealing with a fine productivity to improve the adhesion by two-stage sealing.

The manufacturing method includes: a first step of flip mounting an LED chip 2 on the upper face of a substrate 1; a second step of sticking a pre-setting silicone sheet 4 containing a fluorescent material made of a silicone 6 dispersed with a fluorescent material 5 closely to the upper face and side peripheral face of the LED chip 2 without air therebetween and setting the silicone sheet 4; and a third step of compressively molding a translucent, pre-setting silicone into a lens covering the silicone sheet 4 when the silicone sheet 4 becomes a half-set state in the second step and setting the silicone sheet 4 and the lens at the same time to join them.


Inventors:
Tajima, Hiroyuki
Shimonishi, Shota
Tsuchiya, Yosuke
Application Number:
JP2009000296447
Publication Date:
July 14, 2011
Filing Date:
December 25, 2009
Export Citation:
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Assignee:
TOYODA GOSEI CO LTD
International Classes:
H01L33/50; H01L33/54; H01L33/56