Title:
MANUFACTURING METHOD FOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2015192105
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a light emitting device that prevents heat damage to a light emission color converting member, is able to efficiently dissipate the heat of the light emission color converting member, and is able to make the in-plane distribution of the chromaticity of the surface of the light emission color converting member even.SOLUTION: In a step 2 (FIG. 1(B)), a light emission color converting member 14 is directly fixed to the light-emission-side entire surface of a crystal development substrate 11 without using an adhesive. In step 3 (FIG. 1(C)), in order to impart a desired chromaticity to a light emitting device 10, the light emission color converting member 14 is polished to a desired film thickness. In a step 4 (FIG. 1(D)), the crystal development substrate 11, a semiconductor layer 12, and the light emission color converting member 14 arranged in layers are divided into individual chips by scribe-dicing, thus forming an LED chip 15 in which the light emission color converting member 14 is directly fixed to the light-emission surface.
Inventors:
WADA SATOSHI
Application Number:
JP2014069909A
Publication Date:
November 02, 2015
Filing Date:
March 28, 2014
Export Citation:
Assignee:
TOYODA GOSEI KK
International Classes:
H01L33/50
Domestic Patent References:
| JP2012079776A | 2012-04-19 | |||
| JP2000022222A | 2000-01-21 | |||
| JP2012059939A | 2012-03-22 | |||
| JP2013016588A | 2013-01-24 | |||
| JP2012222320A | 2012-11-12 | |||
| JP2010157638A | 2010-07-15 |
Attorney, Agent or Firm:
Tomimasa Konishi
Tomoko Nakamura
Seiji Kimura
Tomoko Nakamura
Seiji Kimura
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