Title:
METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT
Document Type and Number:
Japanese Patent JP2023132803
Kind Code:
A
Abstract:
To provide a method for manufacturing a light emitting element improved in light extraction efficiency.SOLUTION: A method for manufacturing a light emitting element 100 includes the steps of: preparing a semiconductor structure 10 including a first semiconductor layer 11, a second semiconductor layer 12, and an active layer 13 located between the first semiconductor layer 11 and the second semiconductor layer 12; forming a first light-transmitting conductive layer 21 with a first film thickness at a first temperature, on the second semiconductor layer 12; heating the first light-transmitting conductive layer 21 at a second temperature higher than the first temperature in an oxygen-containing atmosphere; and, after the step of heating, forming a second light-transmitting conductive layer 22 having a second film thickness thicker than the first film thickness at a third temperature higher than the first temperature, on the first light-transmitting conductive layer 21.SELECTED DRAWING: Figure 1
Inventors:
YAGI KENTARO
Application Number:
JP2022038338A
Publication Date:
September 22, 2023
Filing Date:
March 11, 2022
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L33/42
Attorney, Agent or Firm:
Patent Attorney Corporation Toyosu Patent Office