Title:
発光装置の製造方法および切断装置用治具
Document Type and Number:
Japanese Patent JP7100256
Kind Code:
B2
Abstract:
To more efficiently manufacture a light-emitting device by suppressing an end material from being residual on a jig.SOLUTION: A manufacturing method of a light-emitting device includes the steps of: (A) preparing a composite substrate including a device region including multiple unit light-emitting structures and a frame region enclosing the device region, and having a rectangular outer shape; (B) placing the composite substrate on a support part of a cutting device in which a jig is mounted, the jig including a support part having a first groove and a second groove extending in a direction that is different from the first groove, on a top face; (C) using a rotary blade to separate the frame region of the composite substrate from the device region; and (D) dicing the multiple unit light-emitting structures after the step (C). The jig further includes a regulation part which is positioned outside of an outer edge of the frame region of the composite substrate in a second direction. The step (C) includes a step (C1) of inserting the rotary blade through the first groove and cutting the composite substrate, thereby separating a long first end material that is a portion of the frame region, from the device region.SELECTED DRAWING: Figure 10
Inventors:
Kyohei Shirahama
Application Number:
JP2018164376A
Publication Date:
July 13, 2022
Filing Date:
September 03, 2018
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/48; H01L21/301
Domestic Patent References:
| JP2017069509A | ||||
| JP2002239888A | ||||
| JP2015005544A |
Attorney, Agent or Firm:
Okuda Seiji
Kita Osamu
Kajitani Mido
Akiko Miyake
Yu Tanaka
Kita Osamu
Kajitani Mido
Akiko Miyake
Yu Tanaka
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