To allow sure electrical and physical connection with an anisotropic conductive adhesive layer (ACF) by effectively absorbing the variance in level or the like of a substrate in a thermo-compression bonding step and to prevent the reduction in efficiency of heat transmission from a jig for thermo-compression bonding to the ACF.

A liquid crystal display panel 10 is placed on a liquid crystal display panel placing base 1 with a buffer layer 5 between them, and an IC chip 20 is disposed on an extension part 12a of a substrate 12 of the liquid crystal display panel 10 so that mutual electrode terminals face each other with an ACF 25 between them. A jig 2a for thermo-compression bonding of a thermo-compression bonding device 2 is brought into contact with a top surface of the IC chip 20 and is pressed in a direction of the liquid crystal display panel placing base 1 while being heated, to temporarily soften the ACF 25 and then thermally hardens it, and thus electrode terminals of the substrate 12 and the IC chip 20 are made conductive and are fixed by adhesion.