Title:
MANUFACTURING METHOD OF LIQUID JET HEAD, AND LIQUID JET HEAD
Document Type and Number:
Japanese Patent JP2016030402
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a liquid jet head which can secure electrical connection between an electrode terminal and a wiring terminal by reducing positional deviation between the electrode terminal of a head chip and the wiring terminal of a flexible substrate.SOLUTION: A manufacturing method of a liquid jet head includes: a preparation process S1 of preparing a head chip with a plurality of electrode terminals arrayed, and a flexible substrate having a terminal region with a plurality of wiring terminals arrayed; an arrangement process S2 of causing the plurality of electrode terminals to face the plurality of wiring terminals respectively and arranging the flexible substrate on the head chip; a temporary crimping process S3 of fixing the flexible substrate to the head chip by thermally compressing peripheries of both ends of the terminal region in a direction of arraying the wiring terminals; and a main crimping process S4 of electrically connecting the plurality of electrode terminals and the plurality of wiring terminals respectively by thermally compressing the flexible substrate to the head chip.SELECTED DRAWING: Figure 1
Inventors:
NISHIKAWA DAICHI
Application Number:
JP2014154261A
Publication Date:
March 07, 2016
Filing Date:
July 29, 2014
Export Citation:
Assignee:
SII PRINTEK INC
International Classes:
B41J2/16; B41J2/14
Attorney, Agent or Firm:
Noriaki Uchino
Nobuyuki Kimura
Toru Tanikawa
Nobuyuki Kimura
Toru Tanikawa
Previous Patent: SHEET BINDING DEVICE
Next Patent: METHOD AND DEVICE OF CONTROLLING ELECTRIC MOTOR, AND MOLDING DEVICE
Next Patent: METHOD AND DEVICE OF CONTROLLING ELECTRIC MOTOR, AND MOLDING DEVICE