Title:
超薄圧電共振子素板の製造方法及び製造装置
Document Type and Number:
Japanese Patent JP4538871
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve fine adjustment accuracy and prevent reduction in product quality by stopping the progress of etching individually and efficiently. SOLUTION: This method is used for manufacturing of a plurality of ultrathin piezoelectric resonator original plates simultaneously by using a large-area piezoelectric wafer. A plurality of recessed parts 2 are formed on the surface of a piezoelectric wafer 1 in the prescribed arrangement by etching, and then an ultrathin vibration part 3 is formed on the bottom of the respective recessed parts 2 and the variance of the wall thickness of the respective ultrathin vibration parts 3 formed on the piezoelectric wafer 1 is measured. Furthermore, an etchant 16 is dripped in the respective recessed parts 2 to correct the variance in the wall thickness of the ultrathin vibration parts 3 that is detected in the measurement of wall thickness and to reduce it the prescribed value. A prescribed time later after the etchant 16 is dripped, a neutralizing liquid 21 is dripped in the respective recessed parts to neutralize the etching liquid 16, to thereby finely adjust the wall thickness.
Inventors:
Osamu Ishii
Application Number:
JP28214499A
Publication Date:
September 08, 2010
Filing Date:
October 01, 1999
Export Citation:
Assignee:
Epson Toyocom Corporation
International Classes:
H01L41/22; H01L41/09; H01L41/253; H01L41/332; H03H3/02
Domestic Patent References:
| JP621740A | ||||
| JP634461A | ||||
| JP1041771A |
Attorney, Agent or Firm:
Hitoshi Suzuki