Title:
金属-セラミックス接合基板の製造方法
Document Type and Number:
Japanese Patent JP4394477
Kind Code:
B2
Abstract:
There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied on a predetermined portion of a surface of the metal member 14 to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer 12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal 12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer 12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member 14 and the metal layer 12b from being etched and which selectively etch the active metal layer 12b, to form a metal circuit on the ceramic substrate 10. This metal circuit is chemically polished to form a fillet on the peripheral portion of the metal circuit.
Inventors:
Junji Nakamura
Application Number:
JP2004049135A
Publication Date:
January 06, 2010
Filing Date:
February 25, 2004
Export Citation:
Assignee:
DOWA Holdings Co., Ltd.
International Classes:
B23K35/30; C04B37/02; H05K3/06; C23F1/00; C23F1/30; C23F1/40; H01L23/373; H05K3/24; H05K3/38; H05K1/03; H05K3/26
Domestic Patent References:
| JP5013920A | ||||
| JP2000323618A | ||||
| JP2000269615A | ||||
| JP10125821A | ||||
| JP2003060111A | ||||
| JP64081296A |
Attorney, Agent or Firm:
Koichi Okawa