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Title:
キャリア付金属箔、積層体、プリント配線板、電子機器、キャリア付金属箔の製造方法及びプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP6842232
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier high in adhesion force between the carrier and a metal layer before a laminating process to an insulation substrate and capable of easily peeling the carrier from the metal layer without extreme increase or decrease of adhesiveness of the carrier and the metal layer in the laminating process to the insulation substrate.SOLUTION: There is provided a metal foil with a carrier having the carrier, a first intermediate layer containing oxygen and a metal layer in this order, average value of depth from a surface in an intermediate layer side of the peeled carrier in terms of SiOtill oxygen at 10 locations becomes 10 at% or less is 0.5 nm to 15 nm inclusive and standard deviation/average value is 0.6 or less when peeling the carrier from the metal foil with the carrier according to JIS C6471 and conducting analysis of total 10 locations which are 5 locations with 20 mm interval in a width direction (TD direction) and 5 locations with 20 mm interval in a longer direction (MD direction) in the depth direction by AES from the intermediate side of the peeled carrier.SELECTED DRAWING: Figure 5

Inventors:
Yoshitaka Shibuya
Yuta Nagaura
Misato Honda
Mae Nishihara
Application Number:
JP2015072736A
Publication Date:
March 17, 2021
Filing Date:
March 31, 2015
Export Citation:
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Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/22; B32B15/04; C23C22/24; C23C28/00; C25D1/04; H05K1/09
Domestic Patent References:
JP2014195871A
JP2002368365A
JP2015024515A
JP2012099857A
JP2014082490A
Attorney, Agent or Firm:
Axis International Patent Business Corporation