Title:
MANUFACTURING METHOD FOR MOLDED PACKAGE
Document Type and Number:
Japanese Patent JP2015018922
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a molded package, whereby wobbling of a sensor chip is made less liable to occur.SOLUTION: A lead frame 4 having a support part 4c is prepared, and a sensor chip 3 is supported by the support part 4c before the sealing of a mold. Accordingly, wobbling of the sensor chip 3 can be prevented before the sealing of the mold. A lower die 9a is used, which includes a first flat face 9aa, a second flat face 9ac composing the bottom of a recessed part 9ab, and a side wall face 9ab, the boundary between the side wall face 9ab and the second flat face 9ac being located further inside the recessed part 9ab than the boundary between the side wall face 9ad and the first flat face 9aa. The face of the support part 4c, opposite an island part 4a, is located on the boundary between the side wall face 9ad and first flat face 9aa. Thus, troubles such as sensor chip 3 peeling from the mold resin 6 are less liable to occur.
Inventors:
YAMAGUCHI KOHEI
Application Number:
JP2013144907A
Publication Date:
January 29, 2015
Filing Date:
July 10, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L21/56; G01P15/08; H01L23/50; H01L25/00; H01L29/84
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm