多層金属めっき基材の製造方法および金属めっき基材 - Sumitomo Electric Print Circuit Co., Ltd.

Title:

多層金属めっき基材の製造方法および金属めっき基材

Document Type and Number:

Japanese Patent JP5205649

Kind Code:

B2

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Inventors:

Shinobu Yamaguchi
Hideyuki Eifuku
Katsushi Ota
Toshikazu Okazaki
Naoki Katayama
Toshio Fujita
Koji Uchino

Application Number:

JP2007322356A

Publication Date:

June 05, 2013

Filing Date:

December 13, 2007

Export Citation:

Assignee:

Sumitomo Electric Print Circuit Co., Ltd.

International Classes:

C23C18/34; C23C28/00; C23C28/02; C25D5/56; H05K3/18

Domestic Patent References:

Attorney, Agent or Firm:

Noboru Ueno

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